Thomas T. Edman
and Chief Executive Officer
Thomas T. Edman is the CEO of our company since January 2014 and President since January 2013. Mr.
Edman has also served as a Director for our company since September 2004. From early 2011 to December
2012, Mr. Edman served as Group Vice President and General Manager of the AKT Display Business Group,
which is a division of Applied Materials Inc., a publicly held provider of nanomanufacturing technology
solutions. From 2006 to 2011, Mr. Edman
served as Corporate Vice President of Corporate Business Development of Applied Materials,
Inc. Prior to that, Mr. Edman served as President and Chief Executive Officer of
Applied Films Corporation from May 1998 until Applied Materials, Inc. acquired Applied
Films Corporation in July 2006. From June 1996 until May 1998, Mr. Edman served
as Chief Operating Officer and Executive Vice President of Applied Films Corporation.
From 1993 until joining Applied Films, Mr. Edman served as General Manager of the
High Performance Materials Division of Marubeni Specialty Chemicals, Inc., a subsidiary
of a major Japanese trading corporation. Mr. Edman holds a Bachelor of Arts degree
in East Asian studies (Japan) from Yale University and a Master's degree in Business
Administration from The Wharton School at the University of Pennsylvania.
Chief Operating Officer
Brian Barber began his career in the printed circuit board industry in 1982 for Hadco Corporation. From 1994 to 1999, Mr. Barber was the Vice President and Business Unit Manager for the Owego, New York division. Brian held many key roles at Hadco, including positions in operations, procurement and materials management. In 2000, Mr. Barber joined Viasystems as Vice President of Operations. His scope of responsibilities included global management of PCB and Electro Mechanical sites in Europe, North America and Asia. In 2007, Brian was promoted to Senior Vice President of Global Operations and Supply Chain at Viasystems. During his eight year tenure, Mr. Barber successfully integrated multiple PCB manufacturing sites into his global operations platform. In 2015, Mr. Barber became Senior Vice President of the High Technology Business Unit at TTM before his role as COO for the Company. Mr. Barber received his Bachelor's Degree in Psychology from Binghamton University.
Canice T. K. Chung
Executive Vice President Business Development, Asia Pacific
Canice T. K. Chung has served as our Executive Vice President and President,
Asia Pacific Business Unit since April 2012, and prior to that served as Chief Executive
Officer of our Asia Pacific operating segment since April 8, 2010. Prior to joining
our company, Mr. Chung served as Deputy Managing Director of Meadville Group since
2005. Prior to joining the Meadville Group, Mr. Chung was an Executive Director
of Elec & Eltek International Holdings Limited (formerly listed on The Stock Exchange
of Hong Kong Limited) from August 1993 to March 2005 and Elec & Eltek International
Company Limited (a company listed on the Singapore Exchange Securities Trading Limited)
from April 1994 to March 2005. Mr. Chung had been Chief Executive Officer of Elec
& Eltek Group's PCB business and held various management positions at Fairchild
Semiconductors (HK) Limited, China Cement Company (Hong Kong) Limited, the Astec
Group and Chen Hsong Machinery Co, Limited. Mr. Chung graduated from the Hong Kong
Polytechnic University in 1979 in Accountancy. Mr. Chung is currently the Chairman
of the Hong Kong Printed Circuit Association Limited.
Senior Vice President
Kent Hardwick is the Senior Vice President of Global Sales and E-MS. Mr. Hardwick began his career in sales management with Sigma Circuits in 1982, developing regional sales territories throughout North America. In 1992, Kent was promoted to Director of Business Development at Sigma, managing the growth and direction of key multi-national accounts. In 1996, Mr. Hardwick was elevated to Vice President of Sales and Marketing at Sigma Circuits and successfully managed the sales organization through the acquisition by Tyco Electronics in 1998. At Tyco Electronics, Mr. Hardwick was responsible for cultivating the key global account customer base and developing the teams that support them. In 2006, TTM Technologies acquired the Tyco Printed Circuit Group. As Director of Business Development for TTM, Mr. Hardwick managed the growth and transition of critical customer groups. In 2008, Kent was promoted to Vice President of the Global E-MS Business division before his role as SVP of Global Sales for the Company. Mr. Hardwick received his Bachelor's degree in Business Administration from California State University, Hayward.
Senior Vice President
Global Information Technology
Dale Knecht is the Senior Vice President of Global Information Technology. From
2001 to 2006, Mr. Knecht served as Vice President of Information Technology for
the Tyco Electronics Printed Circuit Group. From 2003 to 2006, Mr. Knecht served
in a dual role as Director of IT Regional Governance - North America for Tyco Electronics.
Prior to that, Mr. Knecht served from 1998 to 2001 as Manager, SAP Global Support,
and from 1993 to1998 as Regional Systems Manager - Latin America & Canada for AMP
Inc. Mr. Knecht holds a Bachelor of Science in Mathematics from Lafayette College.
and Industrial & Instrumentation
Jon Pereira is Senior Vice President and President of the Automotive, Medical and I&I Business Unit of TTM. Prior to joining TTM, he was Senior Vice President of the High Reliability Business Unit for Viasystems Inc. Mr. Pereira began his career as a Sales Engineer with Amersham Inc., focusing on industrial applications for the company's products. In 1994, Jon joined Olympic Circuits as Vice President of Operations. In 2001, Olympic was acquired by DDI, and Mr. Pereira assumed the role of Vice President of Operations in Canada. By the end 2010, Mr. Pereira successfully completed the acquisition and integration of Coretec Inc. Mr. Pereira continued in his role with the successful acquisition of DDI, by Viasystems in 2012. Mr. Pereira received his Bachelor of Chemical Engineering at the University of Toronto.
Senior Vice President
Shawn Powers is the Senior Vice President of Human Resources. Mr. Powers joined TTM Technologies in March 2014 as the Vice President of Human Resources for our North America Business Unit. Prior to joining our company, Mr. Powers was the Global Vice President of Human Resources with Kleinfelder, an engineering and sciences company, from 2012 to 2014. Before Kleinfelder, Mr. Powers was the Senior Director of Global Human Resources with IMI plc, a FTSE 100 manufacturing company, from 2006 to 2012. Mr. Powers began his career in the U.S. Military, serving as an Army Aviation Officer. Mr. Powers holds both a Master of International Affairs and a Bachelor of Science degree in Biomedical Science from Texas A&M University. Additionally, he has earned the Global Professional of Human Resources (GPHR) and the Society of Human Resources Professional - Senior Certified Professional (SCP) certifications.
Electro Mechanical Solutions Business Unit
Tony Princiotta is President of the Electro Mechanical Solutions Business Unit. Mr. Princiotta is heavily experienced in leading global operations in the electro-mechanical and systems integration industries. Having joined Viasystems in 2010, he served as Sr. Vice President of Operations for the Assembly Division. Previous roles include Vice President of Systems Integration & Global Enclosure Operations at Solectron. Mr. Princiotta has held various leadership positions with Jonathan Engineered Solutions, Celestica and Electro-Mechanical Solutions Inc. Mr. Princiotta holds an A.B. in Economics from Boston College and a MBA from the University of Massachusetts at Boston.
Todd B. Schull
Executive Vice President and
Chief Financial Officer
Todd B. Schull became our Executive Vice President, Chief Financial Officer, Treasurer
and Secretary in March 2013, having joined our company as an Executive Vice President
in February 2013. Prior to joining TTM, Mr. Schull served as Senior Vice President
of Finance and Corporate Controller of Sanmina Corporation. Prior to joining Sanmina,
Mr. Schull was Corporate Controller of Ultratech from 2003 to 2005. Mr. Schull started
his career with Deloitte LLP and then held leadership positions with Verbatim Corporation,
Solectron Corporation, Tidal Software, Repeater Technologies, and VA Linux. Mr.
Schull holds a Bachelor of Science degree in accounting from the University of Utah.
Douglas L. Soder
Communications and Computing Business Unit
Douglas L. Soder is Executive Vice President and the President of the Communications & Computing Business Unit. Mr. Soder joined TTM in 2006 and previously held the positions of EVP and President of North America Business Unit from 2012 through 2015, and EVP Global Sales from 2006 to 2012. Prior to joining TTM in 2006, he was Executive Vice President of Tyco Electronics - Printed Circuit Group, a position he held from 2001. Mr. Soder began his career in the electronics industry in 1983 with AMP Incorporated, and held a number of sales and sales management assignments with AMP Incorporated, Tyco Printed Circuit Group and AMP-AKZO before becoming Vice President of Sales with Tyco Electronics - Printed Circuit Group in 1996. Mr. Soder received his Bachelor of Arts in Political Science from Dickinson College in 1983.
Aerospace & Defense / Specialty Business Unit
Phil Titterton is the President of the Aerospace & Defense / Specialty Business Unit. Most recently, Phil served as Chief Operating Officer of TTM's North America Business Unit, and from 2006 to 2014 held many leadership roles including Vice President Operations of TTM's North America Business Unit, Vice President of the Aerospace and Defense Operations, as well as General Manager of the Stafford Division. He also held positions as Vice President of Operations and General Manager for Tyco Electronics Printed Circuit Group from 1992 to 2006 before they were acquired by TTM Technologies.
Mr. Titterton began his career in 1987 as an Operations Manager at Proctor and Gamble, followed by an Operations Consulting role at Coopers & Lybrand based out of NYC. Phil holds a Bachelor's Degree in Electrical Engineering from Lehigh University.
General Counsel and Corporate Secretary
Dan Weber leads the Office of the General Counsel which includes the contracts and administration function. Before joining TTM in 2015, Dan served as the General Counsel for Viasystems for approximately 11 years and had served as in-house counsel for Viasystems for over 15 years. Dan previously also served as Vice President and General Counsel of Courtesy Corporation, a plastic molding manufacturer based in the United States, and as General Counsel of International Wire Group, Inc., a multinational insulated and bare copper wire manufacturer. Prior to embarking on his in-house legal career, Dan worked in private practice at Gallop, Johnson & Neuman, L.C. in the corporate and securities group. Mr. Weber completed his undergraduate work from University of Kansas and received his Law Degree from St. Louis University.