Thermal Management Solutions
Why Thermal Management
To operate efficiently and ensure reliability, heat must be removed from heat generating power components.
As a result of faster speeds, reduced format, and more devices being populated on PCB’s, more heat is being generated that must be removed for efficient operation. The move to sustainable energy increased the demand for energy management electronics, which also create much heat because of the high electrical currents used in these applications (power inverters for solar and wind energy, powertrain electronics for HEV, etc).
Thermal Management, through various applications, aids in directing heat away from heat generating system components.
Typical applications for Thermal Management may include:
- Power amplifiers
- DC power supplies
- Power control systems
- RF & MW applications
- Motor control modules
- Electric brake system
- Power-train in EV
High Speed Computing
- Lighting systems - Automotive, Industrial, Consumer
TTM's Thermal Management Solutions
TTM offers a wide range of Thermal Management types to include Via Farms, Heatsinks/Pallets, Heatsink Coins, Embedded Coins, E-Coin, Press Fit Coin (PFC), Metal In-lay and Solder or Adhesive attach.
Additionally, TTMs' Thermal Management Solutions include our patented embedded E-Coin technology along with heatsink coin attachment capabilities and heavy copper. Our expertise in RF & Microwave is unmatched in the industry.