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Glossary of Terms
Interconnect Structures
interconnect structures technology
Conformal plating staggered
microvia interconnection
Copper filled stacked microvia
interconnection
Copper filled "any layer"
interconnection
Layer
2+n+2 (8L)
3+n+3 (8L)
4+n+4, any layer (10L)
LW/S
2-4 mil
2-4 mil
2-4 mil
μVia Size
3-4 mil
3-4 mil
3-4 mil
Board Thickness
19-40 mil
19-40 mil
24-34 mil